ZFP (Zero Foot Print)

  • Component Encircled DUT
  • SLT (System Level Test)/ Board Level Test
  • Support up to 100GHz with Rubber Contactor
  • Fine Pitch (Support 0.25mm~ pitch)

Why need Zero Footprint?

  • The distance between DUT & Components was 2~3mm before 5G device but ut is 800~300um on 5G device board
  • Normal Rubber need at least 2~3 mm space POGO doesn’t support high speed test
  • Zero Footprint rubber is the best solution with high speed performance on 5G
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